DocumentCode :
3536347
Title :
Improving the detection performance of heavy metal halides films by surface treatment
Author :
Fornaro, L. ; Aguiar, I. ; Sasen, N. ; Pérez, M. ; Noguera, A.
Author_Institution :
Compound Semicond. Group, Univ. de la Republica, Rocha, Uruguay
fYear :
2010
fDate :
Oct. 30 2010-Nov. 6 2010
Firstpage :
3793
Lastpage :
3796
Abstract :
Films of three heavy metal halides (BiI3, HgBr2, HgI2) were grown by the PVD method on Pd-coated glass substrates 1”x1” in size. Before the growth substrates were cut in the diagonal direction in order to obtain two representative films for each set. Films were grown under the most appropriate conditions for each material. Film thicknesses ranged between 50 and 200 μm, uniform (10%) for each set. The surface of one half of each film was treated with one of the following reagents: KI 5-10%, DMSO 5%, acetone, EtOH, during 5 s, and dried. Detectors were assembled depositing Pd as front contact for samples of each material before and after etching. For all the detectors guard ring electrodes were used, for eliminating eventual surface leakage currents. Electrical properties were measured for each detector performing current density vs applied voltage curves at room temperature. Response to ionizing radiation was checked exposing detectors to X and gamma radiations from a 241Am source of 3.5 mR/h. The treatment does not influence adhesion film-substrate; etching acts on films surfaces but also influences electrical and response properties. For example, for HgI2 films treated with acetone, resistivity values were in the order of 1011 Ω. cm for the non-etched films and in the order of 1012 Ω. cm for the etched ones, and the signal to noise values were twice as much for etched films than for non-etched ones. The best etchants resulted to be acetone for mercuric iodide and ethanol for bismuth tri-iodide films. Results obtained with treated samples lead us to think that the etching determines a reduction in the surface states in the junction heavy metal halide-Pd. Results show that the surface treatment clearly improves detection performance of the films and thereby it has been included in our film-detector assembling procedure.
Keywords :
X-ray effects; current density; electrical resistivity; etching; gamma-ray effects; leakage currents; radioactive sources; semiconductor growth; semiconductor materials; semiconductor thin films; surface states; vapour deposition; 241Am source; DMSO; EtOH; Hgl2 films; KI; PVD method; Pd-coated glass substrates; X-ray radiation; acetone; adhesion film-substrate; applied voltage curves; bismuth triiodide films; current density; detection performance; diagonal direction; electrical properties; etchants; etching; ethanol; film surfaces; film thicknesses; film-detector assembling procedure; front contact; gamma-ray radiation; growth substrates; guard ring electrodes; heavy metal halide films; ionizing radiation; junction heavy metal halide-Pd; mercuric iodide; nonetched films; resistivity values; response properties; signal-to-noise values; surface leakage currents; surface states; surface treatment; Bismuth; Dark current; Detectors; Etching; Films;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nuclear Science Symposium Conference Record (NSS/MIC), 2010 IEEE
Conference_Location :
Knoxville, TN
ISSN :
1095-7863
Print_ISBN :
978-1-4244-9106-3
Type :
conf
DOI :
10.1109/NSSMIC.2010.5874522
Filename :
5874522
Link To Document :
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