• DocumentCode
    3536449
  • Title

    VF-TLP systems using TDT and TDRT for kelvin wafer measurements and package level testing

  • Author

    Grund, Evan ; Gauthier, Robert

  • Author_Institution
    Oryx Instrum. Corp., Fremont, CA, USA
  • fYear
    2004
  • fDate
    19-23 Sept. 2004
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    Very fast transmission line pulse (VF-TLP) systems described in the literature are time domain reflection (VF-TDR) configurations. Using other TLP configurations, VF-TLP systems can provide new capabilities. A wafer level Kelvin probe system was derived from VF-time domain transmission (VF-TDT). A test fixture board (TFB) using VF-time domain reflection and transmission (VF-TDRT) enables VF-TLP package level testing.
  • Keywords
    electronics packaging; time-domain analysis; transmission lines; Kelvin wafer measurements; VF-TLP systems; VF-time domain reflection and transmission; VF-time domain transmission; package level testing; test fixture board; very fast transmission line pulse; Cables; Fixtures; Kelvin; Packaging; Probes; Pulse measurements; Reflection; Space vector pulse width modulation; System testing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/Electrostatic Discharge Symposium, 2004. EOS/ESD '04.
  • Conference_Location
    Grapevine, TX
  • Print_ISBN
    978-1-5853-7063-4
  • Electronic_ISBN
    978-1-5853-7063-4
  • Type

    conf

  • DOI
    10.1109/EOSESD.2004.5272811
  • Filename
    5272811
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3536449