Title :
Indium-tin bump deposition for the hybridization of CdTe sensors and readout chips
Author :
Heikkinen, Hannele ; Gädda, Akiko ; Salonen, Jaakko ; Monnoyer, Philippe ; Tlustos, Lukas ; Campbell, Michael
Author_Institution :
VTT Tech. Res. Center of Finland, Espoo, Finland
fDate :
Oct. 30 2010-Nov. 6 2010
Abstract :
The article describes a low temperature bump bonding process to assemble CdTe sensors to readout chips. The solder material used is In-Sn with a theoretical melting point of 118 °C. The solder was tested using Timepix readout chips with 30-μm diameter bumps and a 55-μm pitch bonded to CdTe sensors. The first results from these assemblies show very good bumping and bonding yield.
Keywords :
nuclear electronics; readout electronics; semiconductor counters; soldering; solders; CdTe sensors; Timepix readout chips; indium-tin bump deposition; low temperature bump bonding process; melting point; solder material; Bonding; Detectors; Flip chip; Metals; Pixel; Temperature sensors;
Conference_Titel :
Nuclear Science Symposium Conference Record (NSS/MIC), 2010 IEEE
Conference_Location :
Knoxville, TN
Print_ISBN :
978-1-4244-9106-3
DOI :
10.1109/NSSMIC.2010.5874544
