DocumentCode :
3536590
Title :
Technology of infrared rapid thermal annealing and its application in VLSI
Author :
Lin, Hui-Wang ; Liu, Rong-hua ; Chen, Bi-xian ; Luan, Eong-fa
Author_Institution :
Inst. of Microelectron., Tsinghua Univ., Beijing, China
fYear :
1995
fDate :
6-10 Nov 1995
Firstpage :
285
Lastpage :
286
Abstract :
The technology and equipment of the infrared rapid thermal annealing for VLSI is reported. The equipment used for rapid thermal annealing has been made with an radio frequency (RF)-induced graphite heater in a quartz housing as an infrared heating source. By using this technology and equipment the fabrication of shallow junction, the formation of silicide, the effect of BPSG reflow and annihilating the micro defects and thermal donor in CZ Si single crystal are discussed
Keywords :
VLSI; borosilicate glasses; incoherent light annealing; integrated circuit technology; phosphosilicate glasses; rapid thermal annealing; B2O3-P2O5-SiO2; BPSG; BPSG reflow; CZ Si single crystal; IR heating source; RF-induced graphite heater; Si; VLSI; infrared RTA; infrared rapid thermal annealing; micro defects removal; quartz housing; shallow junction formation; silicide formation; thermal donor removal; Heat treatment; Infrared heating; Ion implantation; MOSFET circuits; Microelectronics; Optical device fabrication; Radio frequency; Rapid thermal annealing; Silicides; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics and VLSI, 1995. TENCON '95., IEEE Region 10 International Conference on
Print_ISBN :
0-7803-2624-5
Type :
conf
DOI :
10.1109/TENCON.1995.496395
Filename :
496395
Link To Document :
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