DocumentCode
3536696
Title
Tetrahedral magnetic cluster embedded in metallic matrix: electron correlation effects
Author
Cruz-Silva, E. ; Munoz-Sandoval, E. ; Terrones, M. ; Lopez-Urias, F.
Author_Institution
Dept. of Adv. Mater., Inst. Potosino de Investigacion Cientifica y Tecnologica, San Luis Potosi, Mexico
fYear
2005
fDate
4-8 April 2005
Firstpage
1305
Lastpage
1306
Abstract
The magnetic properties of itinerant electrons and the effects of the electron-correlations are studied on a tetrahedral cluster surrounded by nonmagnetic metallic atoms in the framework of the Hubbard model. This model takes into account the kinetic energy which describes the electronic hopping between nearest neighbor atoms and the on-site Coulomb repulsion only on the atoms of the tetrahedral cluster. The ground-state energy and the wave function are obtained exactly using the numerical diagonalization method. Results demonstrate that for low electron concentration, the tetrahedral cluster shows antiferromagnetic order due to the fact that the electrons prefer to stay in the host metal to avoid the double occupations. However, when the number of the electrons is large, the tetrahedral cluster exhibits a ferromagnetic ground-state.
Keywords
Hubbard model; antiferromagnetism; electron correlations; electron density; ferromagnetism; ground states; hopping conduction; metal clusters; wave functions; Coulomb repulsion; Hubbard model; antiferromagnetic order; electron concentration; electron correlations; electronic hopping; ferromagnetic ground state; ground-state energy; itinerant electrons; kinetic energy; magnetic properties; metallic matrix; nearest neighbor atoms; nonmagnetic metallic atoms; numerical diagonalization method; tetrahedral magnetic cluster; wave function; Antiferromagnetic materials; Atomic measurements; Density functional theory; Electrons; Giant magnetoresistance; Gold; Magnetic materials; Magnetic properties; Nearest neighbor searches; Polarization;
fLanguage
English
Publisher
ieee
Conference_Titel
Magnetics Conference, 2005. INTERMAG Asia 2005. Digests of the IEEE International
Print_ISBN
0-7803-9009-1
Type
conf
DOI
10.1109/INTMAG.2005.1464082
Filename
1464082
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