DocumentCode
3536824
Title
Noble development of Al/NiP substrate with soft magnetic underlayer formation of nano-crystalline and (111) orientation of plated NiFe film
Author
Hashimoto, A. ; Saito, S. ; Takahashi, M. ; Mukia, N.
Author_Institution
Tohoku Univ., Sendai, Japan
fYear
2005
fDate
4-8 April 2005
Firstpage
1309
Lastpage
1330
Abstract
On the purpose of reducing fabrication process, the development of the noble substrate with soft underlayer by means of controlling the microstructure and crystal orientation of a plated soft magnetic layer was carried out. A 2.5-inch Al/NiP disk was prepared as a rigid body of a substrate, and electroless-plated NiFe was used as the soft magnetic material. The structure was examined by cross-sectional transmission electron microscopy, and the magnetic properties were evaluated by vibrating sample magnetometer and longitudinal Kerr equipment. Resulting facts indicate that fabrication of moderate crystal-oriented seed layer can control grain size and crystal orientation of plated NiFe grains by epitaxial growth.
Keywords
Permalloy; aluminium; crystal orientation; electroless deposited coatings; electroplated coatings; epitaxial growth; ferromagnetic materials; grain size; magnetic epitaxial layers; metallic epitaxial layers; nanostructured materials; nickel compounds; soft magnetic materials; substrates; surface structure; transmission electron microscopy; 2.5 inch; Al-NiP; NiFe; cross-sectional transmission electron microscopy; crystal orientation; electroless-plated; epitaxial growth; grain size; longitudinal Kerr equipment; magnetic properties; microstructure; nanocrystalline (111) orientated plated NiFe film; noble Al/NiP substrate; rigid body; soft magnetic underlayer; vibrating sample magnetometer; Crystal microstructure; Fabrication; Grain size; Magnetic films; Magnetic force microscopy; Magnetic properties; Magnetometers; Soft magnetic materials; Substrates; Transmission electron microscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Magnetics Conference, 2005. INTERMAG Asia 2005. Digests of the IEEE International
Print_ISBN
0-7803-9009-1
Type
conf
DOI
10.1109/INTMAG.2005.1464094
Filename
1464094
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