Title :
Mathematical model and heat conduction analysis of a silicon-based thermoelectric enzyme sensor
Author :
Yiqun, Dong ; Wuming, Zhang ; Jiliang, Liu ; Yuquan, Cheng
Author_Institution :
Dept. of BME, Zhejiang Univ., Hangzhou, China
Abstract :
The finite element method (FEM) employed to model the temperature field in a heated silicon plane was discussed, since optimum designing of the micro-silicon structure would be the basis of a micro-machined silicon-based thermal biosensor. In this research, the heat flow originally generated by the enzymatic reaction was conducted in the anisotropically etched silicon and collected by a thermopile array. Fourier´s law and Laplace´s equation were utilized to build the temperature field equations under appropriate boundary conditions in two-dimensions Cartesian coordinates, while FEM was used to calculate the temperature field and model conduction. Meanwhile, several available results for optimum design are reported
Keywords :
Laplace equations; biosensors; electric sensing devices; elemental semiconductors; finite element analysis; heat conduction; microsensors; proteins; silicon; temperature distribution; thermal analysis; thermoelectric devices; thermopiles; FEM; Laplace equation; Si; anisotropically etched Si; boundary conditions; enzymatic reaction; finite element method; heat conduction analysis; heat flow; mathematical model; micro-machined thermal biosensor; micro-silicon structure; optimum design; temperature field; thermoelectric enzyme sensor; thermopile array; two-dimensions Cartesian coordinates; Biochemistry; Biosensors; Etching; Finite element methods; Laplace equations; Mathematical model; Silicon; Temperature sensors; Thermal sensors; Thermoelectricity;
Conference_Titel :
Microelectronics and VLSI, 1995. TENCON '95., IEEE Region 10 International Conference on
Print_ISBN :
0-7803-2624-5
DOI :
10.1109/TENCON.1995.496416
