• DocumentCode
    3537214
  • Title

    Importance of accurate thermal analyses [computer reliability]

  • Author

    Jacobson, David W.

  • Author_Institution
    IBM Application Bus. Syst., Rochester, MN, USA
  • fYear
    1989
  • fDate
    24-26 Jan 1989
  • Firstpage
    465
  • Lastpage
    460
  • Abstract
    The author focuses on the importance of accurate thermal measurements. The reliability impact of junction temperature changes is examined for four different components. This is followed by two case studies done at the card level as opposed to the component level. The first case study involves a memory card in which a cost-saving technology change was made because of a decrease in the estimated junction temperature. The second case covers a processor card which has 15 temperature-sensitive components. The study examines the reliability implications of inaccurately measuring the thermal characteristics of these components. A section on the monetary and competitive aspects of the importance of accurate thermal measurements is included
  • Keywords
    reliability; semiconductor storage; temperature measurement; thermal analysis; accurate thermal analyses; accurate thermal measurements; card level; computer reliability; junction temperature changes; memory card; processor card; reliability impact; temperature-sensitive components; Application software; CMOS logic circuits; Computer aided manufacturing; Contracts; DRAM chips; Jacobian matrices; Maintenance; Semiconductor device measurement; Temperature distribution; Thermal degradation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability and Maintainability Symposium, 1989. Proceedings., Annual
  • Conference_Location
    Atlanta, GA
  • Type

    conf

  • DOI
    10.1109/ARMS.1989.49647
  • Filename
    49647