DocumentCode
3537214
Title
Importance of accurate thermal analyses [computer reliability]
Author
Jacobson, David W.
Author_Institution
IBM Application Bus. Syst., Rochester, MN, USA
fYear
1989
fDate
24-26 Jan 1989
Firstpage
465
Lastpage
460
Abstract
The author focuses on the importance of accurate thermal measurements. The reliability impact of junction temperature changes is examined for four different components. This is followed by two case studies done at the card level as opposed to the component level. The first case study involves a memory card in which a cost-saving technology change was made because of a decrease in the estimated junction temperature. The second case covers a processor card which has 15 temperature-sensitive components. The study examines the reliability implications of inaccurately measuring the thermal characteristics of these components. A section on the monetary and competitive aspects of the importance of accurate thermal measurements is included
Keywords
reliability; semiconductor storage; temperature measurement; thermal analysis; accurate thermal analyses; accurate thermal measurements; card level; computer reliability; junction temperature changes; memory card; processor card; reliability impact; temperature-sensitive components; Application software; CMOS logic circuits; Computer aided manufacturing; Contracts; DRAM chips; Jacobian matrices; Maintenance; Semiconductor device measurement; Temperature distribution; Thermal degradation;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability and Maintainability Symposium, 1989. Proceedings., Annual
Conference_Location
Atlanta, GA
Type
conf
DOI
10.1109/ARMS.1989.49647
Filename
49647
Link To Document