DocumentCode
3537802
Title
Use of functionally gradient material in a temperature measuring element
Author
Watanabe, Shigeo ; AOKI, Katsuki ; IWATA, Hiroyuki ; Hayashi, Niichi ; Ohashi, Asao ; KINOSHITA, Yukihiro ; Uchida, Yoshiyuki ; DYKES, David ; TOUCHARD, Grard
Author_Institution
Aichi Inst. of Technol., Toyota, Japan
fYear
1995
fDate
17-20 Sep 1995
Firstpage
129
Lastpage
132
Abstract
An idea of gradient functions has recently developed in Japan, giving birth to an entirely new concept in materials. The formal name for the new materials is “functionally gradient materials”, or FGMs for short. Application fields for FGMs are found throughout the various sectors of engineering. None of the methods of manufacture or other previously existing ones, allowed the manufacture of a comprehensive range of FGM thicknesses extending from less than 1 millimetre to several centimetres. The authors have developed a new method of FGM manufacture, for which a US patent has been granted. Using this method, it has became possible to produce FGMs across the whole range of thickness from a few millimetres up to several tens of centimetres. We call this new method “progressive lamination”. The present paper examines the resistance-temperature properties of material manufactured by this method. It is found that measurements of temperature differences down to as small as 0.1°C are practicable. The material is well within the range of suitability for use as a thermistor
Keywords
electric sensing devices; laminates; temperature sensors; thermistors; FGMs; functionally gradient material; gradient functions; progressive lamination; resistance-temperature properties; temperature difference measurement; temperature measuring element; thermistor; Biological materials; Conducting materials; Engine cylinders; Inorganic materials; Magnetic materials; Manufacturing; Optical materials; Plasma temperature; Superconducting materials; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulating Materials, 1995. International Symposium on
Conference_Location
Tokyo
Print_ISBN
4-88686-047-8
Type
conf
DOI
10.1109/ISEIM.1995.496525
Filename
496525
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