DocumentCode
3538778
Title
MR enhancement of CPP-GMR by CCP-NOL spacer and Fe50Co50 magnetic layers
Author
Iwasaki, Hisao ; Fukuzawa, H. ; Yuasa, H. ; Kubo, K. ; Koi, K. ; Funayama, T. ; Takagishi, M. ; Tanaka, Y.
Author_Institution
Corp. R & D Center, Toshiba Corp., Kawasaki, Japan
fYear
2005
fDate
4-8 April 2005
Firstpage
1695
Lastpage
1696
Abstract
This paper reports that further increase of magnetoresistance (MR) ratio to 6.5∼8.5% is achieved by using Fe50Co50 magnetic layers, in addition to current-confined-path(CCP)-nanooxide layer(NOL). The CCP-CPP structure is composed of Ta/Ru/PtMn/Co90Fe10/Ru/pinned layer/NOL spacer/free layer/Cu/Ta cap. Using Fe50Co50/Cu as pinned and free layers, an MR ratio of 6.5∼8.5% is obtained at area resistance (RA)=300∼1000 mΩμm2 and if Co90Fe10 is used, MR ratio of 3∼4% is shown at RA∼300 mΩμm2. The increase of MR ratio is explained by increase of spin dependent scattering at the interface of Fe50Co50 and Cu metal path where current is concentrated. Conduction examination shows that there is a resistance increased caused by joule heating effect with increasing voltage, indicating that great majority of current flows in metal paths. The origin of MR comes from nano-constricted metal path regions which dimension is less than the mean free path of electron.
Keywords
cobalt alloys; copper; electron mean free path; enhanced magnetoresistance; ferromagnetic materials; iron alloys; magnetic multilayers; manganese alloys; platinum alloys; ruthenium; tantalum; Ta-Ru-PtMn-Co90Fe10-Cu; area resistance; current-confined-path-nanooxide layer; electron mean free path; film structure; free layer; joule heating effect; magnetic layers; magnetoresistance ratio; nanoconstricted metal path regions; pinned layer; spin dependent scattering; Iron; Lamination; Magnetic films; Nanostructures; Oxidation; Research and development; Scattering; Space technology; Temperature dependence; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Magnetics Conference, 2005. INTERMAG Asia 2005. Digests of the IEEE International
Print_ISBN
0-7803-9009-1
Type
conf
DOI
10.1109/INTMAG.2005.1464281
Filename
1464281
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