• DocumentCode
    3538815
  • Title

    Breakdown behavior of current perpendicular to the plane devices with nano-oxide current screening layers

  • Author

    Hoshino, Kenji ; Watanabe, K. ; Hoshiya, H. ; Meguro, Koichi ; Nakamoto, K.

  • Author_Institution
    Storage Technol. Res. Center, Hitachi Ltd., Odawara, Japan
  • fYear
    2005
  • fDate
    4-8 April 2005
  • Firstpage
    1703
  • Lastpage
    1704
  • Abstract
    The resistance R and magneto-resistance (dR/R) changes of current perpendicular to the plane (CPP) pillars with nano-oxide current screening layers under constant voltage stress are measured. The pillars, with diameter ranging from 50 nm to 4 μm, are antiparallel pinned PtMn spin-valves and the CoFe nano-oxide layer is located in the Cu spacer layer. Results show that an irreversible damage occurs at 170 mV and at this voltage, both the resistance and magneto-resistance decrease. This indicates that pinhole formation and growth in the nano-oxide layer is responsible for the breakdown. As device sizes decrease, breakdown voltages increase from ∼40 mV up to ∼170 mV. This indicates that pinhole formation follows a weakest link model for the larger devices and is induced by reaching a critical current density (voltage) for the smaller devices.
  • Keywords
    copper alloys; current density; electric breakdown; ferromagnetic materials; iron alloys; magnetoresistance; manganese alloys; platinum alloys; spin valves; 40 to 170 mV; 50 to 4000 nm; PtMn-CoFe-Cu; antiparallel pinned spin-valves; breakdown voltage; critical current density; current-perpendicular-to-the-plane pillars; irreversible damage; magnetoresistance; nanooxide current screening layers; pinhole formation; resistance; spacer layer; voltage stress; weakest link model; Breakdown voltage; Current density; Current measurement; Electric breakdown; Electrical resistance measurement; Nanoscale devices; Performance evaluation; Space technology; Stress measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Magnetics Conference, 2005. INTERMAG Asia 2005. Digests of the IEEE International
  • Print_ISBN
    0-7803-9009-1
  • Type

    conf

  • DOI
    10.1109/INTMAG.2005.1464285
  • Filename
    1464285