• DocumentCode
    3540129
  • Title

    Inverse magnetoresistance in magnetic tunnel junction with an Fe3O4 electrode

  • Author

    Park, Chando ; Zhu, Jian-Gang ; Peng, Y. ; Laughlin, D.E. ; White, R.M.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
  • fYear
    2005
  • fDate
    4-8 April 2005
  • Firstpage
    2001
  • Lastpage
    2008
  • Abstract
    This study shows inverse MR in a NiFe/AlOx/ Fe3O4 tunnel junction if sufficiently pure Fe3O4 at the interface with the tunnel barrier can be achieved. Magnetic tunnel junction with the structure of Ta 3 nm/Cu 50 nm/Ta 3 nm/NiFe 10 nm/AlOx 2 nm/Fe (1.8 ∼ 10 nm)-oxidation/Fe 5 nm/Ta 3 nm is deposited on oxidized silicon substrates by using an RF/DC sputtering system. Oxidation of the Fe layer is found to result to an inverse MR. As the unoxidized Fe layer decreases, MR also decreases until it reaches zero, that is, the unoxidized residual Fe phase coexist with the Fe3O4 phase. As the thickness decrease further to 1.8 nm, the MR curve becomes negative (inverse MR).
  • Keywords
    aluminium compounds; copper; iron; iron alloys; iron compounds; nickel alloys; oxidation; sputter deposition; tantalum; tunnelling magnetoresistance; 1.8 nm; 10 nm; 2 nm; 3 nm; 5 nm; 50 nm; Fe3O4; RF-DC sputtering system; Ta-Cu-Ta-NiFe-AlOx-Fe-O-Fe-Ta; inverse magnetoresistance; magnetic tunnel junction; oxidation; silicon substrates; tunnel barrier; Electrodes; Electrons; Iron; Magnetic materials; Magnetic tunneling; Optical polarization; Oxidation; Plasma measurements; Thickness measurement; Tunneling magnetoresistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Magnetics Conference, 2005. INTERMAG Asia 2005. Digests of the IEEE International
  • Print_ISBN
    0-7803-9009-1
  • Type

    conf

  • DOI
    10.1109/INTMAG.2005.1464442
  • Filename
    1464442