• DocumentCode
    3540150
  • Title

    Exact solution for via-plate capacitances including the finite plate thickness

  • Author

    Friedrich, Matthias ; Bednarz, Christian ; Leone, Marco

  • fYear
    2013
  • fDate
    9-13 Sept. 2013
  • Firstpage
    1025
  • Lastpage
    1028
  • Abstract
    In this paper a straightforward analytical solution is presented for the exact calculation of the via plate capacitance in multilayer structures, considering the finite thickness of the plates. The capacitance is obtained from the static potential distribution and results in the determination of a single coefficient of an infinite equation system, which can be truncated after a few unknowns. The convergence of the solution is independent of the plates thickness. Thus the novel approach does not require additional effort in comparison with previous approaches where the plate thickness is omitted. The results are validated by numerical 3D full-wave simulations.
  • Keywords
    capacitance; electric potential; numerical analysis; vias; finite plate thickness; infinite equation system; multilayer structures; numerical 3D full-wave simulations; static potential distribution; via-plate capacitances; Capacitance; Cavity resonators; Equations; Integrated circuit modeling; Mathematical model; Numerical models; Solid modeling; power integrity; signal integrity; via model; via-barrel capacitance; via-pad capacitance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetics in Advanced Applications (ICEAA), 2013 International Conference on
  • Conference_Location
    Torino
  • Print_ISBN
    978-1-4673-5705-0
  • Type

    conf

  • DOI
    10.1109/ICEAA.2013.6632397
  • Filename
    6632397