Title :
Exact solution for via-plate capacitances including the finite plate thickness
Author :
Friedrich, Matthias ; Bednarz, Christian ; Leone, Marco
Abstract :
In this paper a straightforward analytical solution is presented for the exact calculation of the via plate capacitance in multilayer structures, considering the finite thickness of the plates. The capacitance is obtained from the static potential distribution and results in the determination of a single coefficient of an infinite equation system, which can be truncated after a few unknowns. The convergence of the solution is independent of the plates thickness. Thus the novel approach does not require additional effort in comparison with previous approaches where the plate thickness is omitted. The results are validated by numerical 3D full-wave simulations.
Keywords :
capacitance; electric potential; numerical analysis; vias; finite plate thickness; infinite equation system; multilayer structures; numerical 3D full-wave simulations; static potential distribution; via-plate capacitances; Capacitance; Cavity resonators; Equations; Integrated circuit modeling; Mathematical model; Numerical models; Solid modeling; power integrity; signal integrity; via model; via-barrel capacitance; via-pad capacitance;
Conference_Titel :
Electromagnetics in Advanced Applications (ICEAA), 2013 International Conference on
Conference_Location :
Torino
Print_ISBN :
978-1-4673-5705-0
DOI :
10.1109/ICEAA.2013.6632397