Title :
Virtual instrument realization of non-contact silicon wafer test
Author :
Youjun, Yan ; Yunfei, Li
Author_Institution :
Dept. of Electron. Inf. Eng., Suzhou Vocational Univ., Suzhou, China
Abstract :
Based on virtual instrument technology, the paper conducts organic integration of capacitive displacement sensor ranging technology, eddy current sensor resistance testing technology and semiconductor P/N polarity of infrared pulse sensor testing technology, and develops dynamic non-contact silicon wafer testing instrument, which not only simulates the testing instruments like signal generator, digital oscilloscope, programmable power supply and digital multi-meter, but also has the functions like information fusion, data management, motion control and position detection. Dynamic non-contact test is the prior method of high speed and intelligent test of solar cell silicon wafers as well as the need of large-scale production of photovoltaic industry.
Keywords :
capacitive sensors; displacement measurement; eddy currents; electric current measurement; virtual instrumentation; capacitive displacement sensor; eddy current sensor resistance testing technology; infrared pulse sensor testing technology; noncontact silicon wafer testing instrument; semiconductor P/N polarity; solar cell silicon wafers; virtual instrument realization; Capacitive sensors; Eddy current testing; Infrared detectors; Infrared sensors; Instruments; Paper technology; Pulsed power supplies; Semiconductor device testing; Sensor fusion; Silicon; Non-contact test; displacement sensor; eddy current sensor; virtual instrument;
Conference_Titel :
Electronic Measurement & Instruments, 2009. ICEMI '09. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-3863-1
Electronic_ISBN :
978-1-4244-3864-8
DOI :
10.1109/ICEMI.2009.5274005