DocumentCode
3541046
Title
Numerical simulation of on thermal nanoimprint lithography (NIL) process
Author
Cho, Bum-Goo ; Park, Soon-Yeol ; Won, Taeyoung
Author_Institution
Dept. of Electr. Eng., Inha Univ., Incheon, South Korea
fYear
2008
fDate
15-16 June 2008
Firstpage
1
Lastpage
2
Abstract
Nanoimprint lithography (NIL) relies on a direct mechanical deformation of the resist material and can therefore achieve resolutions beyond the limitations which are set by a light diffraction or a beam scattering. In addition, NIL is expected to realize a low cost and high-throughput production. In this work, we modeled the NIL process and employed commercially available software, COMSOL Multi-physics, for the implementation of our model. In this paper, we report the stress distribution of the polymer deformation process on the imprinting pressure.
Keywords
deformation; nanolithography; numerical analysis; soft lithography; thermal stresses; COMSOL multi-physics software; beam scattering; direct mechanical deformation; light diffraction; polymer deformation; stress distribution; thermal nanoimprint lithography; Deformable models; Information technology; Nanolithography; Navier-Stokes equations; Numerical simulation; Photonics; Polymer films; Pressing; Resists; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Silicon Nanoelectronics Workshop, 2008. SNW 2008. IEEE
Conference_Location
Honolulu, HI
Print_ISBN
978-1-4244-2071-1
Type
conf
DOI
10.1109/SNW.2008.5418400
Filename
5418400
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