• DocumentCode
    3541046
  • Title

    Numerical simulation of on thermal nanoimprint lithography (NIL) process

  • Author

    Cho, Bum-Goo ; Park, Soon-Yeol ; Won, Taeyoung

  • Author_Institution
    Dept. of Electr. Eng., Inha Univ., Incheon, South Korea
  • fYear
    2008
  • fDate
    15-16 June 2008
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Nanoimprint lithography (NIL) relies on a direct mechanical deformation of the resist material and can therefore achieve resolutions beyond the limitations which are set by a light diffraction or a beam scattering. In addition, NIL is expected to realize a low cost and high-throughput production. In this work, we modeled the NIL process and employed commercially available software, COMSOL Multi-physics, for the implementation of our model. In this paper, we report the stress distribution of the polymer deformation process on the imprinting pressure.
  • Keywords
    deformation; nanolithography; numerical analysis; soft lithography; thermal stresses; COMSOL multi-physics software; beam scattering; direct mechanical deformation; light diffraction; polymer deformation; stress distribution; thermal nanoimprint lithography; Deformable models; Information technology; Nanolithography; Navier-Stokes equations; Numerical simulation; Photonics; Polymer films; Pressing; Resists; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Silicon Nanoelectronics Workshop, 2008. SNW 2008. IEEE
  • Conference_Location
    Honolulu, HI
  • Print_ISBN
    978-1-4244-2071-1
  • Type

    conf

  • DOI
    10.1109/SNW.2008.5418400
  • Filename
    5418400