A novel low impedance line for MMIC using air-gap stacked structure

Author

Gi-Hyon Ryu ; Dae-Hyun Kim ; Jae-Hak Lee ; Kwang-Seok Seo

Author_Institution

Sch. of Electr. Eng. & ISRC, Seoul Nat. Univ., South Korea

Volume

2

fYear

2000

fDate

11-16 June 2000

Firstpage

613

Abstract

A novel low impedance line for MMIC is proposed which uses air-gap stacked microstrip structure and does not require any dielectric process. The proposed transmission line has the width of about 1/3 times that of the conventional microstrip line. It shows lower transmission loss than thin film low impedance transmission line. The proposed transmission line was used to the matching stub of the balanced amplifier MMIC based on the 0.25 /spl mu/m gate GaAs P-HEMT technology, reducing the chip size by 69% compared with the conventional microstrip-based design.

Keywords

MMIC amplifiers; air gaps; differential amplifiers; impedance matching; microstrip lines; 0.25 micron; GaAs; GaAs P-HEMT technology; MMIC balanced amplifier; air gap stacked microstrip line; low impedance transmission line; matching stub; Air gaps; Dielectric losses; Dielectric substrates; Dielectric thin films; Gallium arsenide; Impedance; MMICs; Microstrip; Power transmission lines; Propagation losses;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest. 2000 IEEE MTT-S International

Conference_Location

Boston, MA, USA

ISSN

0149-645X

Print_ISBN

0-7803-5687-X

Type

conf

DOI

10.1109/MWSYM.2000.863259

Filename

863259