DocumentCode
3541302
Title
High performance Schottky barrier MOSFETs with workfunction engineering
Author
Jang, Moongyu ; Kim, Yarkyeon ; Jun, Myungsim ; Choi, Cheljong
Author_Institution
Nano-Bio Electron. Devices Team, ETRI, Daejeon, South Korea
fYear
2008
fDate
15-16 June 2008
Firstpage
1
Lastpage
2
Abstract
Various sizes of erbium silicided n-/p-type Schottky barrier MOSFETs are manufactured from 20 um to 7 nm. The manufactured SB-MOSFETs show excellent DIBL and subthreshold swing characteristics due to the existence of Schottky barrier between source and channel. It is found that the control of the Schottky barrier height between silicon and ErSi1.7 is the key factor for the increase of drive current. N-type SOI substrate and strained silicon have very low electron Schottky barrier height. The manufactured 20 nm n-/p-type SB-MOSFET showed 550 and 250 uNum saturation current at VGS-VT = VDS = 2 V condition (Tox = 5 nm) with excellent short channel characteristics, which is the highest current level compared with reported data. Also, 10 nm and sub 10 nm SB-MOSFETs characteristics are obtained.
Keywords
MOSFET; Schottky barriers; erbium compounds; silicon-on-insulator; DIBL; SB-MOSFET; SOI substrate; electron Schottky barrier height; erbium silicided Schottky barrier MOSFET; saturation current; short channel characteristics; size 10 nm; size 20 mum to 7 nm; size 20 nm; strained silicon; subthreshold swing characteristics; workfunction engineering; Electron mobility; Erbium; MOSFETs; Manufacturing; Rapid thermal annealing; Schottky barriers; Schottky diodes; Silicidation; Silicides; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Silicon Nanoelectronics Workshop, 2008. SNW 2008. IEEE
Conference_Location
Honolulu, HI
Print_ISBN
978-1-4244-2071-1
Type
conf
DOI
10.1109/SNW.2008.5418432
Filename
5418432
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