DocumentCode :
3541302
Title :
High performance Schottky barrier MOSFETs with workfunction engineering
Author :
Jang, Moongyu ; Kim, Yarkyeon ; Jun, Myungsim ; Choi, Cheljong
Author_Institution :
Nano-Bio Electron. Devices Team, ETRI, Daejeon, South Korea
fYear :
2008
fDate :
15-16 June 2008
Firstpage :
1
Lastpage :
2
Abstract :
Various sizes of erbium silicided n-/p-type Schottky barrier MOSFETs are manufactured from 20 um to 7 nm. The manufactured SB-MOSFETs show excellent DIBL and subthreshold swing characteristics due to the existence of Schottky barrier between source and channel. It is found that the control of the Schottky barrier height between silicon and ErSi1.7 is the key factor for the increase of drive current. N-type SOI substrate and strained silicon have very low electron Schottky barrier height. The manufactured 20 nm n-/p-type SB-MOSFET showed 550 and 250 uNum saturation current at VGS-VT = VDS = 2 V condition (Tox = 5 nm) with excellent short channel characteristics, which is the highest current level compared with reported data. Also, 10 nm and sub 10 nm SB-MOSFETs characteristics are obtained.
Keywords :
MOSFET; Schottky barriers; erbium compounds; silicon-on-insulator; DIBL; SB-MOSFET; SOI substrate; electron Schottky barrier height; erbium silicided Schottky barrier MOSFET; saturation current; short channel characteristics; size 10 nm; size 20 mum to 7 nm; size 20 nm; strained silicon; subthreshold swing characteristics; workfunction engineering; Electron mobility; Erbium; MOSFETs; Manufacturing; Rapid thermal annealing; Schottky barriers; Schottky diodes; Silicidation; Silicides; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Silicon Nanoelectronics Workshop, 2008. SNW 2008. IEEE
Conference_Location :
Honolulu, HI
Print_ISBN :
978-1-4244-2071-1
Type :
conf
DOI :
10.1109/SNW.2008.5418432
Filename :
5418432
Link To Document :
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