DocumentCode :
3542499
Title :
MoVES — A framework for modelling and verifying embedded systems
Author :
Brekling, Aske ; Hansen, Michael R. ; Madsen, Jan
Author_Institution :
DTU Inf., Tech. Univ. of Denmark, Lyngby, Denmark
fYear :
2009
fDate :
19-22 Dec. 2009
Firstpage :
149
Lastpage :
152
Abstract :
The MoVES framework is being developed to assist in the early phases of embedded systems design. A system is modelled as an application running on an execution platform. The application is modelled through the individual tasks, and the execution platform is modelled through the processing elements, including the operating systems, and their interconnections. The tasks and processing elements are characterized by their real-time properties. The framework can be used to conduct schedulability analysis and has the potential to reason about different types of resource usage such as memory usage and power consumption. A simple specification language for embedded systems and a verification backend are presented. The framework has a modular, parameterized structure supporting easy extension and adaptation of the specification language as well as of the verification backend. We show, using a number of small examples, how MoVES can be used to model and analyze embedded systems.
Keywords :
embedded systems; formal verification; microprocessor chips; multiprocessing systems; specification languages; MoVES framework; embedded systems design; embedded systems modelling; embedded systems verification; execution platform; memory usage; power consumption; processing elements; schedulability analysis; specification language; task elements; verification backend; Embedded system; Energy consumption; Informatics; LAN interconnection; Microelectronics; Operating systems; Power system modeling; Specification languages; Subspace constraints; Telephony;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics (ICM), 2009 International Conference on
Conference_Location :
Marrakech
Print_ISBN :
978-1-4244-5814-1
Type :
conf
DOI :
10.1109/ICM.2009.5418667
Filename :
5418667
Link To Document :
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