DocumentCode
354350
Title
Membrane-supported Ka band resonator employing organic micromachined packaging
Author
Harriss, J.E. ; Pearson, L.W. ; Wang, X. ; Barren, C.H. ; Pham, A.-V.
Author_Institution
Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA
Volume
2
fYear
2000
fDate
11-16 June 2000
Firstpage
1225
Abstract
A scheme for employing organic materials for micromachining of the packaging structure of membrane-supported millimeter wave circuits is described. The format of the packaging follows that devised by Brown, Blondy, and Rebeiz [1999]. The organic micromachining process employs bulk parts patterned photolithographically from Epon(R) SU-8 photoresist adhered to polyimide membranes. Conducting elements are formed by evaporation of gold, followed by electroplating for thickness build up.
Keywords
MIMIC; electroplating; integrated circuit packaging; micromachining; micromechanical resonators; photoresists; Au; Epon SU-8 photoresist; bulk parts; conducting elements; electroplating; membrane-supported Ka band resonator; millimeter wave circuits; organic micromachined packaging; polyimide membranes; Biomembranes; Circuits; Gold; Micromachining; Optical films; Optical resonators; Organic materials; Packaging; Polyimides; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest. 2000 IEEE MTT-S International
Conference_Location
Boston, MA, USA
ISSN
0149-645X
Print_ISBN
0-7803-5687-X
Type
conf
DOI
10.1109/MWSYM.2000.863580
Filename
863580
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