DocumentCode :
3543956
Title :
A three-level toggle-avoid bus signaling scheme
Author :
Zhang, Yan ; Blalock, Travis ; Stan, Mircea R.
Author_Institution :
ECE Dept., Virginia Univ., Charlottesville, VA, USA
fYear :
2005
fDate :
23-26 May 2005
Firstpage :
1843
Abstract :
Coupling capacitances between bus lines are dominant in deep-submicron technologies, as a result, both power dissipation and worst-case delay are increased due to coupling transitions. Based on the observation that the toggling sequences 01->10 or 10->01 between two adjacent lines result in four times more coupling energy than other coupling events, we propose a toggle-avoid signaling scheme. By applying a three-level signaling on buses with a choice for representing logic "1", toggling events are reduced with no extra bus lines. We achieve 32% total power savings and 40% worst-case delay reduction with a small power overhead.
Keywords :
capacitance; integrated circuit interconnections; power consumption; system-on-chip; bus lines; bus signaling scheme; coupling capacitances; coupling transitions; deep-submicron technologies; delay reduction; power dissipation; power savings; three-level toggle-avoid scheme; worst-case delay; Capacitance; Delay; Encoding; Energy consumption; Energy dissipation; Logic; Power dissipation; System-on-a-chip; Voltage; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems, 2005. ISCAS 2005. IEEE International Symposium on
Print_ISBN :
0-7803-8834-8
Type :
conf
DOI :
10.1109/ISCAS.2005.1464969
Filename :
1464969
Link To Document :
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