• DocumentCode
    3544177
  • Title

    The understanding of multi-level RTN in trigate MOSFETs through the 2D profiling of traps and its impact on SRAM performance: A new failure mechanism found

  • Author

    Hsieh, E.R. ; Tsai, Y.L. ; Chung, Steve S. ; Tsai, C.H. ; Huang, R.M. ; Tsai, C.T.

  • Author_Institution
    Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2012
  • fDate
    10-13 Dec. 2012
  • Abstract
    The impact of multi-level RTN on SRAM cells bas been experimentally demonstrated on both planar and trigate CMOS devices. First, to study multi-level RTN, a simple experimental method has been developed to take the 2D profiling of multi-traps in both oxide depth (vertical) and channel(lateral) directions in the gate oxide. Then, the role of traps in the switching mechanisms of SRAM cells has also been examined. Results show that the multi-traps will degrade RSNM (read static noise margin), as well as cause transition failure in SRAM operations. This is the first being observed and reported that will be considered as a major criterion in the future low voltage design of SRAM cells.
  • Keywords
    CMOS digital integrated circuits; MOSFET; SRAM chips; failure analysis; 2D profiling; RSNM; SRAM cells; cause transition failure; channel directions; gate oxide; lateral directions; low voltage design; multilevel RTN; multitraps; oxide depth; planar CMOS devices; read static noise margin; switching mechanisms; trigate MOSFET; vertical directions; Electron traps; Logic gates; MOS devices; MOSFET circuits; SRAM cells; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2012 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0163-1918
  • Print_ISBN
    978-1-4673-4872-0
  • Electronic_ISBN
    0163-1918
  • Type

    conf

  • DOI
    10.1109/IEDM.2012.6479072
  • Filename
    6479072