DocumentCode
3544177
Title
The understanding of multi-level RTN in trigate MOSFETs through the 2D profiling of traps and its impact on SRAM performance: A new failure mechanism found
Author
Hsieh, E.R. ; Tsai, Y.L. ; Chung, Steve S. ; Tsai, C.H. ; Huang, R.M. ; Tsai, C.T.
Author_Institution
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear
2012
fDate
10-13 Dec. 2012
Abstract
The impact of multi-level RTN on SRAM cells bas been experimentally demonstrated on both planar and trigate CMOS devices. First, to study multi-level RTN, a simple experimental method has been developed to take the 2D profiling of multi-traps in both oxide depth (vertical) and channel(lateral) directions in the gate oxide. Then, the role of traps in the switching mechanisms of SRAM cells has also been examined. Results show that the multi-traps will degrade RSNM (read static noise margin), as well as cause transition failure in SRAM operations. This is the first being observed and reported that will be considered as a major criterion in the future low voltage design of SRAM cells.
Keywords
CMOS digital integrated circuits; MOSFET; SRAM chips; failure analysis; 2D profiling; RSNM; SRAM cells; cause transition failure; channel directions; gate oxide; lateral directions; low voltage design; multilevel RTN; multitraps; oxide depth; planar CMOS devices; read static noise margin; switching mechanisms; trigate MOSFET; vertical directions; Electron traps; Logic gates; MOS devices; MOSFET circuits; SRAM cells; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting (IEDM), 2012 IEEE International
Conference_Location
San Francisco, CA
ISSN
0163-1918
Print_ISBN
978-1-4673-4872-0
Electronic_ISBN
0163-1918
Type
conf
DOI
10.1109/IEDM.2012.6479072
Filename
6479072
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