DocumentCode
3544503
Title
Alignment-free injection-molded plastic modules for free-space optical interconnection
Author
Kim, Tae Jin ; Neilson, David T. ; Schenfeld, E.
Author_Institution
NEC Res. Inst., Princeton, NJ, USA
fYear
1998
fDate
3-8 May 1998
Firstpage
350
Lastpage
351
Abstract
Summary form only given. We propose a solution to this packaging and alignment problem by using low-cost, injection-molded plastic optical multichip modules (OMCM). This OMCM is a complete hybrid integration of optical, optomechanical, optoelectronic, and electronic components in a self-aligned single platform. The module integrates microlenses, beam-splitting surfaces, and module-to-module connectors and spacers and has room for integrating the optoelectronics devices directly on it.
Keywords
integrated optoelectronics; lenses; modules; optical beam splitters; optical interconnections; plastics; IC packaging; alignment problem; alignment-free injection-molded plastic modules; beam-splitting surfaces; free-space optical interconnection; low-cost injection-molded plastic optical multichip modules; microlenses; module-to-module connectors; optoelectronics devices; self-aligned single platform; Connectors; Electronic components; Electronics packaging; Integrated optics; Lenses; Microoptics; Multichip modules; Optical devices; Optoelectronic devices; Plastic packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics, 1998. CLEO 98. Technical Digest. Summaries of papers presented at the Conference on
Conference_Location
San Francisco, CA, USA
Print_ISBN
1-55752-339-0
Type
conf
DOI
10.1109/CLEO.1998.676284
Filename
676284
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