Thermal and optical analysis of multi-chip LED packages with different electrical connection and driving current

Author

Lim, Ming Yeng ; Gan, Sik Hong ; Lee, Sze Yen ; Lee, Zhi Yin ; Devarajan, Mutharasu

Author_Institution

Sch. of Phys., Univ. Sains Malaysia, Minden, Malaysia

fYear

2012

fDate

10-11 July 2012

Firstpage

232

Lastpage

236

Abstract

The junction temperature and the thermal resistance are vital characteristics that will determine the overall performance of LED packages. The influence of two different electrical connections of multi-chip LED packages on the thermal and optical characteristics is discussed in this paper. The thermal and optical characteristics of the LED package are investigated. Measurements are carried out on LED packages with series and parallel connections in sequence. The objective of this study is to compare the thermal and optical performance of the LED packages with different electrical connections. Experimental results revealed that there is a slight variation of 3 to 5% in R_thJA and ΔT_J values between both connections. For both thermal and optical measurements, the results for parallel connection are observed to be better than that for series connection.

Keywords

light emitting diodes; multichip modules; thermal analysis; thermal resistance; driving current; electrical connection; multi-chip LED packages; optical analysis; parallel connections; series connections; thermal analysis; thermal resistance; Electronic packaging thermal management; Heating; Junctions; Light emitting diodes; Temperature measurement; Thermal resistance; Series connection; junction temperature rise; optical measurement; parallel connection; structure function; thermal resistance; thermal transient measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Quality Electronic Design (ASQED), 2012 4th Asia Symposium on

Conference_Location

Penang

Print_ISBN

978-1-4673-2687-2

Type

conf

DOI

10.1109/ACQED.2012.6320507

Filename

6320507