Signaling analysis of inter-chip I/O package routing for Multi-Chip Package

Multi-Chip Package (MCP) is becoming a customary form of integration in many high performance and advanced electronic devices. The vast adoptions of this technology are mainly contributed by advantages for instance lower power consumption, heterogeneous integration of multiple silicon process technologies and manufacturers, shorter time-to-market and lower costs [1]. However, the high density interchip I/O routing within package presents unique signaling challenges when coupled with high operating data rate. This paper focuses on the signaling analysis of the inter-chip I/O package routing between silicon devices in MCP. In this study, high level signal quality and eye margin sensitivity were evaluated from 2.5GHz up-to 7.5GHz. The microwave effect is found dominating the transmission line component that resulted in signal quality deteriorations. Key limiting factors such as crosstalk coupling effects, signal reflections and frequency dependent losses that caused signal quality degradations were identified and categorized according to the operating frequency and channel length for future MCP design considerations.