DocumentCode
3544831
Title
Simulation of ohmic heating power suppl Y for HL-2M
Author
Wang, Y.L. ; Liu, P.G. ; Wang, Y.Q. ; Mao, X.H. ; Yao, L.Y. ; Li, Qifeng ; Ren, Q.H. ; Xuan, W.M.
Author_Institution
Southwestern Inst. of Phys. (SWIP), Chengdu, China
fYear
2013
fDate
16-21 June 2013
Firstpage
1
Lastpage
1
Abstract
Summary form only given. A new conventional magnets tokamak HL-2M (Ip <; 3 MA, Bt = 2.4 T, R = 1.78 m, a = 0.65 m) will be built in Sout hwestern Institute of Physics (SWIP). The Ohmic Heating (O H) power supply feeds the OH coil, which may provide about 220kA. In order to make full use of the flux swing of OH coi l, 4-quadrant converter will be adopted. Both positive and ne gative converters are 12-pulse thyristor bridge and they will b e switched with circulating current to make the current smoot h near zero-crossing point. In order to verify the feasibility of OH power supply design, simulation study based on Simulink is carried out. The simulation focuses on the circuit topology, control mode, line impedance, all kinds of the fault, the bidirectional thyristor crowbar protection and selection of the thysistors. The simulation and analysis results show that the circuit topology is feasible. Output curve is reasonable through optimizing control and circuit parameters. The highest parameters of the power supply are basically the same in each stage.
Keywords
Tokamak devices; convertors; magnets; network topology; plasma ohmic heating; plasma simulation; plasma toroidal confinement; thyristors; 12-pulse thyristor bridge; Simulink; Sout hwestern Institute of Physics; bidirectional thyristor crowbar protection; circuit topology; circulating current; control mode; conventional magnets; design; hydrogen oxide coil; hydrogen oxide power supply; l, 4-quadrant converter; line impedance; ohmic heating power supply feeds; optimizing control; plasma simulation; tokamak HL-2M; Circuit topology; Heating; Integrated circuit modeling; Magnetic flux; Physics; Power supplies; Thyristors;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma Science (ICOPS), 2013 Abstracts IEEE International Conference on
Conference_Location
San Francisco, CA
ISSN
0730-9244
Type
conf
DOI
10.1109/PLASMA.2013.6633252
Filename
6633252
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