• DocumentCode
    3544904
  • Title

    Nondestructive testing of dynamic elasticmodulus of wood-basedpanel by the method of stress wave

  • Author

    Xiao, Jiang ; Sa, Chao ; Han, Ying

  • Author_Institution
    Dept. of Autom., Beijing Forestry Univ., Beijing, China
  • fYear
    2009
  • fDate
    16-19 Aug. 2009
  • Abstract
    Testing method by velocity of stress wave is widely used in the nondestructive testing system of strength of wood-based panel. Considering higher and higher requirement of accuracy on the testing system, the research developed testing system of stress wave velocity based on SCM in this paper. SCM is used as processing corn. The research calculated dynamic elastic modulus of wood-based panel, which was based on real-time tested data, such as velocity of stress wave and density of wood-based panel. And bending strength of wood-based panel is determinate on correlation of dynamic elastic modulus and bending strength. Then the research realizes strength rating on the wood-based panel. The research discussed on the testing principle, gave out concrete circuit of hardware and design of programming, and also carried out experimental verification of testing system in this paper.
  • Keywords
    bending strength; elastic moduli; mechanical engineering computing; microprocessor chips; nondestructive testing; stress effects; structural panels; wood; SCM; bending strength; dynamic elastic modulus; nondestructive testing system; processing corn; single chip microcomputer; stress wave method; stress wave velocity; wood-based panel; wood-based panel strength; Automatic testing; Circuit testing; Electronic equipment testing; Impulse testing; Materials testing; Mechanical factors; Nondestructive testing; Stress measurement; System testing; Vehicle dynamics; single chip microcomputer (SCM) stress wave wood-based panel bending strength;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Measurement & Instruments, 2009. ICEMI '09. 9th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-3863-1
  • Electronic_ISBN
    978-1-4244-3864-8
  • Type

    conf

  • DOI
    10.1109/ICEMI.2009.5274565
  • Filename
    5274565