• DocumentCode
    3544998
  • Title

    Precise rate of flow piezoelectric mini-pump with built-in self test

  • Author

    Fan, Zunqiang ; Yang, Zhigang ; Dong, Jingshi ; Tian, Fengjun ; Jiang, Bin

  • Author_Institution
    Coll. of Mech. Sci. & Technol., Jilin Univ., Changchun, China
  • fYear
    2009
  • fDate
    16-19 Aug. 2009
  • Abstract
    This paper presents a built-in self test pump actuated by piezoelectric bimorphs for fluidic systems. The sensor fabricated by MEMS ensures the flow to be 0.1 mul/s. The pump is characterized by thin structure, precise rate of flow, low power consumption, etc. A prototype of the pump, with a size of 20 mm, 20 mm and 7 mm, is fabricated by precise manufacturing. Simulations and experiments show that the piezoelectric pump has high efficiency and good performance. With a voltage of 75 V, the flow rate is 0.5 mul every three electronic pulses and its power consumption is only 2.6 mW. A robust passive high pressure check valve is developed for piezoelectric actuated pumps. A novel metal check valve flap is used to increase the valve´s structural stiffness with pressures up to 20.4 kPa. A series-wound multi-pump chamber structure prevents valve-flap from failure under extreme high pressure.
  • Keywords
    built-in self test; elastic constants; microfluidics; microsensors; piezoelectric devices; pumps; valves; MEMS sensor; built-in self test; electronic pulses; flow piezoelectric minipump; fluidic systems; metal check valve flap; passive high pressure check valve; piezoelectric actuated pumps; piezoelectric bimorphs; structural stiffness; Automatic testing; Energy consumption; Manufacturing; Micromechanical devices; Prototypes; Pumps; Sensor phenomena and characterization; System testing; Valves; Voltage; Built-in self test; Multi-chamber pump; Piezoelectric pump; Piezoelectric vibrator;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Measurement & Instruments, 2009. ICEMI '09. 9th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-3863-1
  • Electronic_ISBN
    978-1-4244-3864-8
  • Type

    conf

  • DOI
    10.1109/ICEMI.2009.5274578
  • Filename
    5274578