Title :
Failure modes and failure analysis of white LEDs
Author :
Wu, Fugen ; Zhao, Wei ; Yang, Shaohua ; Zhang, Chunhua
Author_Institution :
Exp. Center, Guangdong Univ. of Technol., Guangzhou, China
Abstract :
Reliability is one of primarily considered problems in white LED application. In this presentation, main failure modes in white LEDs such as ohmic contact degradation, electrode bonding defect, thermal mismatch and degradation of the encapsulation material, as well as ESD damage were analyzed, also combination with many failure analysis practices. Finally, several reliability assurance measures were discussed, which is helpful to improve reliability of LEDs in the solid state lighting applications.
Keywords :
electrodes; electrostatic discharge; encapsulation; failure (mechanical); failure analysis; light emitting diodes; lighting; ohmic contacts; reliability; electrode bonding defect; electrostatic discharge damage; encapsulation material degradation; failure analysis; failure modes; ohmic contact degradation; reliability; solid state lighting applications; thermal mismatch; white LED; Bonding; Conducting materials; Electrodes; Electronic packaging thermal management; Encapsulation; Failure analysis; Light emitting diodes; Ohmic contacts; Thermal conductivity; Thermal degradation; Failure analysis; White LED; degradation; failure modes;
Conference_Titel :
Electronic Measurement & Instruments, 2009. ICEMI '09. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-3863-1
Electronic_ISBN :
978-1-4244-3864-8
DOI :
10.1109/ICEMI.2009.5274756
