DocumentCode
3546348
Title
Variation tolerant logic mapping for crossbar array nano architectures
Author
Tunc, Cihan ; Tahoori, Mehdi B.
Author_Institution
Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
fYear
2010
fDate
18-21 Jan. 2010
Firstpage
855
Lastpage
860
Abstract
Bottom-up self-assembly nanofabrication process yields nanodevices with significantly more variations compared to the conventional top-down lithography used in CMOS fabrication. This is in addition to an increased defect density expected for self-assembled nanodevices. Therefore, it is one of the major design challenges to tolerate variation, in addition to defect tolerance, in emerging nano architectures. In this paper, we present a solution for variation tolerant logic mapping for FET based crossbar array nano architectures using Simulated Annealing. Furthermore, we extended the framework for defect tolerance. Experimental results including comparison with exact method confirm the effectiveness of the proposed approach.
Keywords
CMOS integrated circuits; field effect transistors; lithography; nanofabrication; semiconductor device models; semiconductor device reliability; simulated annealing; tolerance analysis; CMOS fabrication; FET based crossbar array nano architectures; defect density; self-assembled nanodevices; self-assembly nanofabrication process; simulated annealing; top-down lithography; variation tolerant logic mapping; Assembly; Computer architecture; FETs; Lithography; Logic arrays; Manufacturing; Nanowires; Self-assembly; Silicon; Switches;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference (ASP-DAC), 2010 15th Asia and South Pacific
Conference_Location
Taipei
Print_ISBN
978-1-4244-5765-6
Electronic_ISBN
978-1-4244-5767-0
Type
conf
DOI
10.1109/ASPDAC.2010.5419682
Filename
5419682
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