• DocumentCode
    3546395
  • Title

    3-D micromachined hemispherical shell resonators with integrated capacitive transducers

  • Author

    Sorenson, L.D. ; Gao, X. ; Ayazi, F.

  • Author_Institution
    Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2012
  • fDate
    Jan. 29 2012-Feb. 2 2012
  • Firstpage
    168
  • Lastpage
    171
  • Abstract
    We present a self-aligned fabrication method developed for three-dimensional (3-D) microscale hemispherical shell resonators with integrated capacitive transducers and a center post for electrical access to the shell. The self-aligned process preserves the axisymmetry for robust, balanced resonators that can potentially reach very high-Q due to suppressed anchor loss. High-Q operation of a thin polycrystalline silicon shell resonator is verified by exciting devices capacitively into a breathing resonance mode, with measured Q of 8,000 at 412 kHz in vacuum. This process can be further optimized to batch-fabricate micro-hemispherical resonator gyroscopes for portable inertial navigation.
  • Keywords
    capacitive sensors; microfabrication; micromechanical resonators; 3D micromachined hemispherical shell resonators; electrical access; frequency 412 kHz; integrated capacitive transducers; microhemispherical resonator gyroscopes; portable inertial navigation; self-aligned fabrication method; thin polycrystalline silicon shell resonator; Electrodes; Etching; Fabrication; Gyroscopes; Plugs; Silicon; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on
  • Conference_Location
    Paris
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4673-0324-8
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2012.6170120
  • Filename
    6170120