Dry transfer bonding of porous silicon membranes to OSTE(+) polymer microfluidic devices

Author

Saharil, Farizah ; Gylfason, Kristinn B. ; Liu, Yitong ; Haraldsson, Tommy ; Bettotti, Paolo ; Kumar, Neeraj ; Van Der Wijngaart, Wouter

Author_Institution

Microsyst. Technol. Lab., KTH R. Inst. of Technol., Stockholm, Sweden

fYear

2012

fDate

Jan. 29 2012-Feb. 2 2012

Firstpage

232

Lastpage

234

Abstract

We present low temperature transfer bonding of porous silicon membranes to polymeric microfluidic devices, using neither adhesives nor bond surface treatment. The transfer is enabled by a novel dual cure ternary monomer system containing thiolene and epoxy. The ability of the epoxy to react with almost any dry substrate provides a very versatile fabrication method. We characterize the two stage curing mechanism, describe the device fabrication, and evaluate the bond strength.

Keywords

bonding processes; elemental semiconductors; microfabrication; microfluidics; polymers; porous semiconductors; silicon; OSTE(+) polymer microfluidic device; bond strength evaluation; device fabrication; dry substrate; dry transfer bonding; dual cure ternary monomer system; epoxy; fabrication method; low temperature transfer bonding; porous silicon membranes; thiolene; Biomembranes; Bonding; Microfluidics; Polymers; Silicon; Substrates; Surface treatment;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on

Conference_Location

Paris

ISSN

1084-6999

Print_ISBN

978-1-4673-0324-8

Type

conf

DOI

10.1109/MEMSYS.2012.6170133

Filename

6170133