Title :
High yield packaging for high-density multi-channel chip integration on flexible parylene substrate
Author :
Chang, Jay Han-Chieh ; Kang, Dongyang ; Tai, Yu-Chong
Author_Institution :
California Inst. of Technol., Pasadena, CA, USA
fDate :
Jan. 29 2012-Feb. 2 2012
Abstract :
This paper reports a new chip packaging technique for the assembly of retinal prosthesis device. Here, a photoresist is used as glue to attach a chip to the targeted parylene-C substrate so that 94% of the chip area is used as attachment to prevent delamination. As a validation, chips with 268 connections were used to assess the connection yield. The results show that this new technique, combined with an additional parylene-C coating, provide a high connection yield (>;90%) and is a promising method for high-lead-count implant devices.
Keywords :
assembling; delamination; eye; integrated circuit packaging; photoresists; prosthetics; chip packaging technique; connection yield; delamination; flexible parylene substrate; high yield packaging; high-density multichannel chip integration; high-lead-count implant devices; parylene-C coating; photoresist; retinal prosthesis device assembly; targeted parylene-C substrate; Electrodes; Implants; Integrated circuits; Packaging; Resists; Retina; Substrates;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on
Conference_Location :
Paris
Print_ISBN :
978-1-4673-0324-8
DOI :
10.1109/MEMSYS.2012.6170160
