Model-based analysis of switch degradation effects during lifetime testing

The paper reports on the transient analysis of the observed decrease in the actuation voltage of MEMS ohmic switches, under a stress condition. A finite difference model (FDM) is developed that provides insight into the contributions of various mechanical factors to the measured changes in switch performance. In particular, the proposed method allows us to investigate the effects of spring constant reduction and plastic deformation of the switch. Such an analysis cannot be done on the basis of an empirical fitting or existing analytical models. The presented method can be used in the lifetime evaluation of the switch and this application is demonstrated.