• DocumentCode
    3546591
  • Title

    Viscoplasticity of parylene-C film at body temperature

  • Author

    Lin, Jeffrey Chun-Hui ; Lam, Gilbert ; Tai, Yu-Chong

  • Author_Institution
    California Inst. of Technol., Pasadena, CA, USA
  • fYear
    2012
  • fDate
    Jan. 29 2012-Feb. 2 2012
  • Firstpage
    476
  • Lastpage
    479
  • Abstract
    As parylene-C, a thermal plastic, has been extensively used as an implant material, its viscoplastic behavior at body temperature has never been systematically studied. Presented here is the first extensive in vitro study of the viscoplastic behaviors of 20-μm-thick parylene-C film at 37°C. The viscoplastic behaviors are investigated by uniaxial tensile tests at different strain rates (Figure 2), cyclic loading/unloading test (Figure 3) abrupt strain rate changing (Figure 4), creep-recovery (Figure 5), and stress-relaxation (Figure 6). There are three major conclusions here. First, below a stress of 2.5MPa, no observable viscoplastic behavior of 20-μm-thick parylene-C is found. Secondly, parylene-C film is a strain (or stress) and strain-rate dependent viscoplastic material. Thirdly, Burger´s model is adequate to describe both creep and stress relaxation behaviors. In addition, the rate of the creep recovery (modeled with a single time constant) and stress relaxation (modeled with two time constants) decreases with increasing applied stress and/or strain.
  • Keywords
    polymer films; recovery-creep; stress relaxation; tensile strength; tensile testing; viscoplasticity; Burger model; creep-recovery; cyclic loading-unloading test; implant material; parylene-C film; size 20 mum; strain rate; stress relaxation; temperature 37 degC; thermal plastic; uniaxial tensile tests; viscoplasticity; Creep; Films; Fitting; Load modeling; Loading; Strain; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on
  • Conference_Location
    Paris
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4673-0324-8
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2012.6170170
  • Filename
    6170170