• DocumentCode
    3546636
  • Title

    A scalable, modular, multi-stage, peristaltic, electrostatic gas micro-pump

  • Author

    Besharatian, Ali ; Kumar, Karthik ; Peterson, Rebecca L. ; Bernal, Luis P. ; Najafi, Khalil

  • Author_Institution
    Center for Wireless Integrated MicroSensing & Syst. (WIMS), Univ. of Michigan, Ann Arbor, MI, USA
  • fYear
    2012
  • fDate
    Jan. 29 2012-Feb. 2 2012
  • Firstpage
    1001
  • Lastpage
    1004
  • Abstract
    This paper presents a new high-density, scalable, peristaltic gas micropump, fabricated using a high-yield and modular technology. Previously our group introduced the first peristaltic electrostatic gas micropump, utilizing fluidic resonance and multi-stage configuration, which achieved the highest pressure and flow at the lowest power ever reported for a gas micropump. The micropump reported here utilizes the same operating principle, but with major modifications in device structure, architecture, fabrication technology, and pump assembly and packaging. The new pump is significantly more space efficient than the previous design and can be fabricated on one single sided silicon wafer and assembled modularly (in parts), providing much greater testing and characterization capabilities at different points in the process, as well as a significantly higher yield and better control over critical pump parameters.
  • Keywords
    electronics packaging; electrostatic devices; elemental semiconductors; microassembling; microfabrication; microfluidics; micropumps; peristaltic flow; pipe flow; silicon; characterization capability; device architecture; device fabrication technology; device structure; fluidic resonance; high-density scalable peristaltic gas micropump; multistage configuration; multistage electrostatic gas micropump; pump assembly; pump packaging; single sided silicon wafer; testing capability; Electrodes; Fabrication; Micropumps; Packaging; Resonant frequency; Valves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on
  • Conference_Location
    Paris
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4673-0324-8
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2012.6170183
  • Filename
    6170183