Title :
Wafer-level processing for polymer-based planar micro cryogenic coolers
Author :
Wang, Y.D. ; Lewis, R. ; Lin, M. -H ; Radebaugh, R. ; Lee, Y.C.
Author_Institution :
Univ. of Colorado, Boulder, CO, USA
fDate :
Jan. 29 2012-Feb. 2 2012
Abstract :
In this paper, we present the fabrication and testing of a novel polymer-based Joule-Thomson (J-T) micro cryogenic cooler (MCC). Techniques including monolithic fabrication of high pressure polymer channels and 3-D interconnect for fluid channels including a flow resistance are developed to fabricate a planar MCC. The MCC contains a polymer heat exchanger and a silicon/glass J-T valve. A low temperature of 233 K was achieved under an operation pressure ratio of 0.7:0.15 MPa by using a custom designed mixed refrigerant. It is the first demonstration ever reported for J-T MCCs fabricated and assembled based on wafer-level processes.
Keywords :
Joule-Thomson effect; microfluidics; three-dimensional integrated circuits; wafer level packaging; 3D interconnect; Joule Thomson micro cryogenic cooler; flow resistance; fluid channels; high pressure polymer channels; monolithic fabrication; polymer based planar micro cryogenic coolers; wafer level processing; Cryogenics; Fabrication; Glass; Heating; Polyimides; Silicon; Valves;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on
Conference_Location :
Paris
Print_ISBN :
978-1-4673-0324-8
DOI :
10.1109/MEMSYS.2012.6170205