Title :
A claw type of MEMS probe card for the electrical testing of micro-solder ball
Author :
Lai, T. ; Tsou, C.
Author_Institution :
Electr. & Commun. Eng., Feng Chia Univ., Taichung, Taiwan
fDate :
Jan. 29 2012-Feb. 2 2012
Abstract :
This paper presents a micromachined claw probe with electroplating nickel for micro-solder ball electrical testing applications. The suspension claw structure consists of two bridges and four curved cantilevers, which have a flexible spring constant in a small region. The typical bending cantilever structure, made by nickel electroplating, had a thickness of 6.5μm, a width of 10μm and a length of 80μm. The maximum out-of-plane deflections of the fabricated 40×40 claw-probe array were approximately 50μm, under the effect of residual tensile stress. For the probing test of the micro-solder ball with diameter 200μm, the contact resistance was about 20Ω when the contact force was 6.7mN.
Keywords :
electroplating; internal stresses; micromachining; solders; bending cantilever structure; claw probe array; claw type MEMS probe card; electrical testing; electroplating nickel; flexible spring constant; micromachined claw probe; microsolder ball; out of plane deflections; probing test; residual tensile stress; suspension claw structure; Contact resistance; Fabrication; Force; Nickel; Probes; Silicon; Testing;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on
Conference_Location :
Paris
Print_ISBN :
978-1-4673-0324-8
DOI :
10.1109/MEMSYS.2012.6170206
