DocumentCode
3546715
Title
Designs on flip-glass of LED package for selective enhancement of emitting-intensity and view-angle
Author
Chang-Chien, Chien-Lin ; Huang, Yu-Che ; Yip, Ming-Chuen ; Fang, Weileun
Author_Institution
Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fYear
2012
fDate
Jan. 29 2012-Feb. 2 2012
Firstpage
349
Lastpage
352
Abstract
The concept of “Flip Glass Substrate” LED package design for white light has been reported in [1]. For emitting-intensity improvement or view-angle adjustment of the packaged LED, this study further presents the designs, such as surface-patterning and surface-trenching, on flip-glass. Measurements on the package LED demonstrate: (1) the surface-patterning of flip-glass reduce refraction at the surface, causing an increase of light emission intensity. It leads 3.8% emitting-intensity improvement in blue-light and 6.8% in white-light at chromaticity x=0.29, (2) the edge-trench of flip-glass (Fig.1e) provides tilt sidewalls to reduce internal refraction. It leads 5.5% emitting-intensity improvement in blue-light and 7.3% in white-light at chromaticity x=0.29, and (3) the central-trench of flip-glass (Fig.1f) can improve the view-angle of LED. Measurements indicate the view-angle is increased from 120° to 160° in blue-light and from 120° to 150° in white-light, however, the emitting-intensity decreases 2.7% for blue-light and 8.2% for white-light at chromaticity x=0.29. In summary, this study reports simple flip-glass surface machining approach to adjust the performances of LED for different applications.
Keywords
electronics packaging; light emitting diodes; blue light; central trench; chromaticity; edge trench; emitting intensity; flip glass substrate LED package design; flip glass surface machining; light emission intensity; surface patterning; surface refraction; surface trenching; view angle adjustment; white light; Glass; Image edge detection; Light emitting diodes; Lighting; Photonics; Substrates; Surface treatment;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on
Conference_Location
Paris
ISSN
1084-6999
Print_ISBN
978-1-4673-0324-8
Type
conf
DOI
10.1109/MEMSYS.2012.6170207
Filename
6170207
Link To Document