• DocumentCode
    3546715
  • Title

    Designs on flip-glass of LED package for selective enhancement of emitting-intensity and view-angle

  • Author

    Chang-Chien, Chien-Lin ; Huang, Yu-Che ; Yip, Ming-Chuen ; Fang, Weileun

  • Author_Institution
    Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • fYear
    2012
  • fDate
    Jan. 29 2012-Feb. 2 2012
  • Firstpage
    349
  • Lastpage
    352
  • Abstract
    The concept of “Flip Glass Substrate” LED package design for white light has been reported in [1]. For emitting-intensity improvement or view-angle adjustment of the packaged LED, this study further presents the designs, such as surface-patterning and surface-trenching, on flip-glass. Measurements on the package LED demonstrate: (1) the surface-patterning of flip-glass reduce refraction at the surface, causing an increase of light emission intensity. It leads 3.8% emitting-intensity improvement in blue-light and 6.8% in white-light at chromaticity x=0.29, (2) the edge-trench of flip-glass (Fig.1e) provides tilt sidewalls to reduce internal refraction. It leads 5.5% emitting-intensity improvement in blue-light and 7.3% in white-light at chromaticity x=0.29, and (3) the central-trench of flip-glass (Fig.1f) can improve the view-angle of LED. Measurements indicate the view-angle is increased from 120° to 160° in blue-light and from 120° to 150° in white-light, however, the emitting-intensity decreases 2.7% for blue-light and 8.2% for white-light at chromaticity x=0.29. In summary, this study reports simple flip-glass surface machining approach to adjust the performances of LED for different applications.
  • Keywords
    electronics packaging; light emitting diodes; blue light; central trench; chromaticity; edge trench; emitting intensity; flip glass substrate LED package design; flip glass surface machining; light emission intensity; surface patterning; surface refraction; surface trenching; view angle adjustment; white light; Glass; Image edge detection; Light emitting diodes; Lighting; Photonics; Substrates; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on
  • Conference_Location
    Paris
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4673-0324-8
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2012.6170207
  • Filename
    6170207