DocumentCode :
3546715
Title :
Designs on flip-glass of LED package for selective enhancement of emitting-intensity and view-angle
Author :
Chang-Chien, Chien-Lin ; Huang, Yu-Che ; Yip, Ming-Chuen ; Fang, Weileun
Author_Institution :
Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fYear :
2012
fDate :
Jan. 29 2012-Feb. 2 2012
Firstpage :
349
Lastpage :
352
Abstract :
The concept of “Flip Glass Substrate” LED package design for white light has been reported in [1]. For emitting-intensity improvement or view-angle adjustment of the packaged LED, this study further presents the designs, such as surface-patterning and surface-trenching, on flip-glass. Measurements on the package LED demonstrate: (1) the surface-patterning of flip-glass reduce refraction at the surface, causing an increase of light emission intensity. It leads 3.8% emitting-intensity improvement in blue-light and 6.8% in white-light at chromaticity x=0.29, (2) the edge-trench of flip-glass (Fig.1e) provides tilt sidewalls to reduce internal refraction. It leads 5.5% emitting-intensity improvement in blue-light and 7.3% in white-light at chromaticity x=0.29, and (3) the central-trench of flip-glass (Fig.1f) can improve the view-angle of LED. Measurements indicate the view-angle is increased from 120° to 160° in blue-light and from 120° to 150° in white-light, however, the emitting-intensity decreases 2.7% for blue-light and 8.2% for white-light at chromaticity x=0.29. In summary, this study reports simple flip-glass surface machining approach to adjust the performances of LED for different applications.
Keywords :
electronics packaging; light emitting diodes; blue light; central trench; chromaticity; edge trench; emitting intensity; flip glass substrate LED package design; flip glass surface machining; light emission intensity; surface patterning; surface refraction; surface trenching; view angle adjustment; white light; Glass; Image edge detection; Light emitting diodes; Lighting; Photonics; Substrates; Surface treatment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on
Conference_Location :
Paris
ISSN :
1084-6999
Print_ISBN :
978-1-4673-0324-8
Type :
conf
DOI :
10.1109/MEMSYS.2012.6170207
Filename :
6170207
Link To Document :
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