Inkjet-printed microshell encapsulation: A new zero-level packaging technology

Author

Park, E.S. ; Jeon, J. ; Subramanian, V. ; Liu, T. -J King

Author_Institution

Univ. of California, Berkeley, CA, USA

fYear

2012

fDate

Jan. 29 2012-Feb. 2 2012

Firstpage

357

Lastpage

360

Abstract

A low-thermal-budget (CMOS-compatible) process for microshell encapsulation of MEMS devices is proposed. Inkjet-printing of silver (Ag) nanoparticle ink is demonstrated to form porous microshells through which sacrificial oxide (SiO2) can be selectively removed to release MEMS structures. A second inkjet printing process using finer gold (Au) nanoparticle ink is demonstrated to effectively seal the microshells. The mechanical strength of a printed microshell (~3 μm thick) is sufficient for encapsulating regions greater than 1 mm in length.

Keywords

CMOS integrated circuits; encapsulation; gold; ink jet printing; micromechanical devices; nanoparticles; silver; Ag; Au; CMOS-compatibility; MEMS devices; MEMS structures; gold nanoparticle ink; inkjet printing process; inkjet-printed microshell encapsulation; low-thermal-budget process; mechanical strength; porous microshells; sacrificial oxide; silver nanoparticle ink; zero-level packaging technology; Encapsulation; Gold; Ink; Micromechanical devices; Nanoparticles; Printing; Silver; Solvents;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on

Conference_Location

Paris

ISSN

1084-6999

Print_ISBN

978-1-4673-0324-8

Type

conf

DOI

10.1109/MEMSYS.2012.6170208

Filename

6170208