Substrate coupling in mixed-mode and RF integrated circuits

Author

Verghese, Nishath K. ; Allstot, David J.

Author_Institution

Cadence Design Syst. Inc., San Jose, CA, USA

fYear

1997

fDate

7-10 Sep 1997

Firstpage

297

Lastpage

303

Abstract

This paper overviews substrate coupling in mixed mode and RF integrated circuits. Verification methods are reviewed with emphasis on modeling techniques for the substrate. An efficient substrate coupling simulation methodology is presented that utilizes macromodels of the circuit, substrate and package, and a design example is illustrated

Keywords

MMIC; UHF integrated circuits; circuit analysis computing; crosstalk; digital simulation; integrated circuit design; integrated circuit modelling; mixed analogue-digital integrated circuits; IC design; RF integrated circuits; macromodels; mixed-mode integrated circuits; modeling techniques; simulation methodology; substrate coupling; verification methods; Analog circuits; Coupling circuits; Crosstalk; Failure analysis; Impact ionization; Integrated circuit noise; Packaging; Radio frequency; Radiofrequency integrated circuits; Substrate hot electron injection;

fLanguage

English

Publisher

ieee

Conference_Titel

ASIC Conference and Exhibit, 1997. Proceedings., Tenth Annual IEEE International

Conference_Location

Portland, OR

ISSN

1063-0988

Print_ISBN

0-7803-4283-6

Type

conf

DOI

10.1109/ASIC.1997.617025

Filename

617025

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3546869