Title :
Substrate coupling in mixed-mode and RF integrated circuits
Author :
Verghese, Nishath K. ; Allstot, David J.
Author_Institution :
Cadence Design Syst. Inc., San Jose, CA, USA
Abstract :
This paper overviews substrate coupling in mixed mode and RF integrated circuits. Verification methods are reviewed with emphasis on modeling techniques for the substrate. An efficient substrate coupling simulation methodology is presented that utilizes macromodels of the circuit, substrate and package, and a design example is illustrated
Keywords :
MMIC; UHF integrated circuits; circuit analysis computing; crosstalk; digital simulation; integrated circuit design; integrated circuit modelling; mixed analogue-digital integrated circuits; IC design; RF integrated circuits; macromodels; mixed-mode integrated circuits; modeling techniques; simulation methodology; substrate coupling; verification methods; Analog circuits; Coupling circuits; Crosstalk; Failure analysis; Impact ionization; Integrated circuit noise; Packaging; Radio frequency; Radiofrequency integrated circuits; Substrate hot electron injection;
Conference_Titel :
ASIC Conference and Exhibit, 1997. Proceedings., Tenth Annual IEEE International
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-4283-6
DOI :
10.1109/ASIC.1997.617025
