• DocumentCode
    3546920
  • Title

    Thermally actuated silicon tuning fork resonators for sensing applications in air

  • Author

    Beardslee, L.A. ; Lehmann, J. ; Carron, C. ; Su, J. -J ; Josse, F. ; Dufour, I. ; Brand, O.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2012
  • fDate
    Jan. 29 2012-Feb. 2 2012
  • Firstpage
    607
  • Lastpage
    610
  • Abstract
    This paper introduces an electrothermally actuated, piezoresistively detected, silicon-based tuning fork geometry as a suitable platform for resonant sensing applications in air. Operated at their fundamental tuning fork mode (fTF ≈ 400 kHz), in which the two tines oscillate with 180° phase shift to each other, the devices exhibit Q-factors of 4000-4200 in air. By properly choosing the locations of the integrated excitation resistors as well as the four piezoresistors forming a Wheatstone bridge, output signals stemming from low-frequency out-of-plane vibration modes of the microstructure are successfully suppressed. As a result, the tuning forks can be easily embedded into an amplifying feedback loop, achieving short-term frequency stabilities in air as low as 0.02 ppm (0.008 Hz) for gate times of 1 sec. Coated with a chemically sensitive polymer film, the tuning forks were used as mass-sensitive sensors with detection limits in the low-ppm range for toluene.
  • Keywords
    air; chemical sensors; crystal resonators; frequency stability; microsensors; piezoelectric actuators; polymer films; resistors; vibrations; Q factor; Wheatstone bridge; air; chemically sensitive polymer film; electrothermal actuator; feedback loop amplification; frequency stability; integrated excitation resistors; mass sensitive sensors; microstructure suppression; out of plane vibration modes; piezoresistors; resonant sensor; silicon based tuning fork; Films; Frequency measurement; Resistors; Resonant frequency; Sensors; Silicon; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on
  • Conference_Location
    Paris
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4673-0324-8
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2012.6170261
  • Filename
    6170261