DocumentCode :
3546948
Title :
Implementation of vertical-integrated dual mode inductive-capacitive proximity sensor
Author :
Lo, Pei-Hsuan ; Hong, Chitsung ; Tseng, Shih-Hsiung ; Yeh, Jen-Hao ; Fang, Weileun
Author_Institution :
Inst. of NanoEngineering & Microsyst., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fYear :
2012
fDate :
Jan. 29 2012-Feb. 2 2012
Firstpage :
640
Lastpage :
643
Abstract :
This study extends the authors´ previous concept to employ nanoporous anodic aluminum oxide (np-AAO) as insulation and dielectric layer [1] to form the vertical-integrated inductive-capacitive proximity sensor. The advantages of this vertical-integrated inductive-capacitive proximity sensor are as follows, (1) enlarge the range of sensing distance: capacitive-sensing remains sensitive for short-distance object and long-distance object remains detectable by inductive-sensing, (2) conductive and non-conductive objects can be detected, (3) chip size is reduced by the vertical-integrated design, (4) fringe-effect is enhanced by the spiral-coil, and (5) np-AAO has good electrical properties: dielectric constant 7.4 (oxide:3.9), electrical resistivity: over hundred MΩ,-cm (similar to oxide). Preliminary fabrication results demonstrate the vertically integrated inductive-capacitive proximity sensor, and the tests show its sensing-range can reach 0.5~5mm.
Keywords :
capacitive sensors; inductive sensors; insulation; microfabrication; microsensors; nanoporous materials; object detection; conductive object detection; dielectric constant; dielectric layer; electrical property; electrical resistivity; fringe-effect enhancement; long-distance object sensitivity; nanoporous anodic aluminum oxide insulation; nonconductive object detection; np-AAO insulation; short-distance object sensitivity; spiral-coil; vertical-integrated dual mode inductive-capacitive proximity sensor; Capacitance; Fingers; Metals; Robot sensing systems; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on
Conference_Location :
Paris
ISSN :
1084-6999
Print_ISBN :
978-1-4673-0324-8
Type :
conf
DOI :
10.1109/MEMSYS.2012.6170268
Filename :
6170268
Link To Document :
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