Title :
Thermal-driven multilevel routing for 3D ICs
Author :
Cong, Jason ; Zhang, Yan
Author_Institution :
Dept. of Comput. Sci., UCLA, Los Angeles, CA, USA
Abstract :
3D IC has a great potential for improving circuit performance and degree of integration. It is also an attractive platform for system-on-chip or system-in-package solutions. A critical issue in 3D circuit design is heat dissipation. In this paper we propose an efficient 3D multilevel routing approach that includes a novel through-the-silicon via (TS-via) planning algorithm. The proposed approach features an adaptive lumped resistive thermal model and a two-step multilevel TS-via planning scheme. Experimental results show that with multilevel TS-via planning, the thermal-driven approach can reduce the maximum temperature to the required temperature with reasonable wirelength increase. Compared to a post processing approach for dummy TS-via insertion, to achieve the same required temperature, our approach uses 80% fewer TS-vias. To our knowledge, this proposed approach is the first thermal-driven 3D routing algorithm.
Keywords :
integrated circuit design; network routing; 3D circuit design; 3D integrated circuit; 3D multilevel routing; TS-via insertion; adaptive thermal model; heat dissipation; lumped resistive thermal model; multilevel TS-via planning scheme; system-in-package; system-on-chip; thermal-driven multilevel routing; through-the-silicon via planning algorithm; two-step TS-via planning scheme; Algorithm design and analysis; Circuit synthesis; Finite difference methods; Integrated circuit packaging; Routing; System-on-a-chip; Temperature; Thermal conductivity; Thermal resistance; Three-dimensional integrated circuits;
Conference_Titel :
Design Automation Conference, 2005. Proceedings of the ASP-DAC 2005. Asia and South Pacific
Print_ISBN :
0-7803-8736-8
DOI :
10.1109/ASPDAC.2005.1466143
