DocumentCode
3548032
Title
Wave-pipelined on-chip global interconnect
Author
Zhang, Lizheng ; Hu, Yuhen ; Chen, Charlie Chung-Ping
Author_Institution
Dept. of ECE, Wisconsin Univ., Madison, WI, USA
Volume
1
fYear
2005
fDate
18-21 Jan. 2005
Firstpage
127
Abstract
A novel wave-pipelined global interconnect system is developed for reliable, high throughput, on-chip data communication. We argue that because there is only a single signal propagation path and a single type of 1-input gate (inverter), a wave-pipelined interconnect will have less stringent timing constraints than a wave-pipelined combinational logic block. A phase-lock loop based clock and data recovery unit architecture, adopted from off-chip high speed digital serial link, is designed for on-chip application so as to minimize power and area cost. Preliminary Monte Carlo simulation indicated that the wave-pipelined global interconnect architecture potentially can offer 18% higher throughput than a flip-flop pipelined global interconnect architecture at about the same level of reliability. While delivering data through long interconnect at the same bit rate, the wave-pipelined architecture consumes less power and requires less chip real estate.
Keywords
Monte Carlo methods; data communication; flip-flops; integrated circuit interconnections; logic design; phase locked loops; Monte Carlo simulation; flip-flop pipelined global interconnect architecture; high-speed digital serial link; on-chip data communication; phase-lock loop; signal propagation path; wave-pipelined combinational logic block; wave-pipelined on-chip global interconnect; Bit rate; Clocks; Costs; Data communication; Flip-flops; Power system interconnection; Pulse inverters; System-on-a-chip; Throughput; Timing;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2005. Proceedings of the ASP-DAC 2005. Asia and South Pacific
Print_ISBN
0-7803-8736-8
Type
conf
DOI
10.1109/ASPDAC.2005.1466144
Filename
1466144
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