Title :
Wave-pipelined on-chip global interconnect
Author :
Zhang, Lizheng ; Hu, Yuhen ; Chen, Charlie Chung-Ping
Author_Institution :
Dept. of ECE, Wisconsin Univ., Madison, WI, USA
Abstract :
A novel wave-pipelined global interconnect system is developed for reliable, high throughput, on-chip data communication. We argue that because there is only a single signal propagation path and a single type of 1-input gate (inverter), a wave-pipelined interconnect will have less stringent timing constraints than a wave-pipelined combinational logic block. A phase-lock loop based clock and data recovery unit architecture, adopted from off-chip high speed digital serial link, is designed for on-chip application so as to minimize power and area cost. Preliminary Monte Carlo simulation indicated that the wave-pipelined global interconnect architecture potentially can offer 18% higher throughput than a flip-flop pipelined global interconnect architecture at about the same level of reliability. While delivering data through long interconnect at the same bit rate, the wave-pipelined architecture consumes less power and requires less chip real estate.
Keywords :
Monte Carlo methods; data communication; flip-flops; integrated circuit interconnections; logic design; phase locked loops; Monte Carlo simulation; flip-flop pipelined global interconnect architecture; high-speed digital serial link; on-chip data communication; phase-lock loop; signal propagation path; wave-pipelined combinational logic block; wave-pipelined on-chip global interconnect; Bit rate; Clocks; Costs; Data communication; Flip-flops; Power system interconnection; Pulse inverters; System-on-a-chip; Throughput; Timing;
Conference_Titel :
Design Automation Conference, 2005. Proceedings of the ASP-DAC 2005. Asia and South Pacific
Print_ISBN :
0-7803-8736-8
DOI :
10.1109/ASPDAC.2005.1466144