Title :
Statistical modeling of cross-coupling effects in VLSI interconnects
Author :
Agarwal, Mridul ; Agarwal, Kanak ; Sylvester, Dennis ; Blaauw, David
Author_Institution :
Indian Inst. of Technol., Kanpur, India
Abstract :
In this paper, we develop an approach for statistical modeling of crosstalk noise and dynamic delay degradation in coupled RC interconnects under process variations. The proposed model enables closed-form computation of mean and variance of noise peak and worst case dynamic delay for given variabilities in physical dimensions. We compare the proposed model against HSPICE Monte Carlo simulations and report an average error in mean and standard deviation of noise peak to be 2.7% and 3.7% respectively.
Keywords :
RC circuits; SPICE; VLSI; crosstalk; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; HSPICE Monte Carlo simulations; VLSI interconnects; coupled RC interconnects; cross-coupling effects; crosstalk noise; dynamic delay degradation; process variations; statistical modeling; Capacitance; Computational modeling; Crosstalk; Degradation; Delay estimation; Dielectrics; Gaussian distribution; Propagation delay; Very large scale integration; Wire;
Conference_Titel :
Design Automation Conference, 2005. Proceedings of the ASP-DAC 2005. Asia and South Pacific
Print_ISBN :
0-7803-8736-8
DOI :
10.1109/ASPDAC.2005.1466215
