• DocumentCode
    3548133
  • Title

    The effects of temperature and humidity exposure on reliability of silicon nanowires

  • Author

    Wejinya, Uchechukwu C. ; Willems, Nathan ; Zhuxin Dong

  • Author_Institution
    Dept. of Mech. Eng., Univ. of Arkansas, Fayetteville, AR, USA
  • fYear
    2013
  • fDate
    10-13 Nov. 2013
  • Firstpage
    119
  • Lastpage
    122
  • Abstract
    Material reliability is among the crucial factors that impact material performances before device applications. In order to predict material reliability, accelerated aging study-a study to predict material shelf life when subjected to temperature and humidity, was performed on silicon nanowires. We investigated the effects of process conditions on the diameter and the quality of SiNWs using Atomic Force Microscopy followed by statistical analysis. The experimental results revealed diameter of SiNWs has a linear relationship with changing temperature and humidity. These results are of significant importance and will be a critical design consideration for the use of SiNWs in biomedical implants.
  • Keywords
    atomic force microscopy; biomedical materials; humidity; nanomedicine; nanowires; prosthetics; silicon; statistical analysis; Si; atomic force microscopy; biomedical implants; humidity exposure effects; material reliability; silicon nanowire reliability; statistical analysis; temperature effects; Accelerated aging; Humidity; Nanowires; Silicon; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Molecular Medicine and Engineering (NANOMED), 2013 IEEE 7th International Conference on
  • Conference_Location
    Phuket
  • Print_ISBN
    978-1-4799-2689-3
  • Type

    conf

  • DOI
    10.1109/NANOMED.2013.6766326
  • Filename
    6766326