DocumentCode
3548133
Title
The effects of temperature and humidity exposure on reliability of silicon nanowires
Author
Wejinya, Uchechukwu C. ; Willems, Nathan ; Zhuxin Dong
Author_Institution
Dept. of Mech. Eng., Univ. of Arkansas, Fayetteville, AR, USA
fYear
2013
fDate
10-13 Nov. 2013
Firstpage
119
Lastpage
122
Abstract
Material reliability is among the crucial factors that impact material performances before device applications. In order to predict material reliability, accelerated aging study-a study to predict material shelf life when subjected to temperature and humidity, was performed on silicon nanowires. We investigated the effects of process conditions on the diameter and the quality of SiNWs using Atomic Force Microscopy followed by statistical analysis. The experimental results revealed diameter of SiNWs has a linear relationship with changing temperature and humidity. These results are of significant importance and will be a critical design consideration for the use of SiNWs in biomedical implants.
Keywords
atomic force microscopy; biomedical materials; humidity; nanomedicine; nanowires; prosthetics; silicon; statistical analysis; Si; atomic force microscopy; biomedical implants; humidity exposure effects; material reliability; silicon nanowire reliability; statistical analysis; temperature effects; Accelerated aging; Humidity; Nanowires; Silicon; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Molecular Medicine and Engineering (NANOMED), 2013 IEEE 7th International Conference on
Conference_Location
Phuket
Print_ISBN
978-1-4799-2689-3
Type
conf
DOI
10.1109/NANOMED.2013.6766326
Filename
6766326
Link To Document