Packaging of a monolithic microwave/optical receiver chip with an optical fiber

Author

Vusirikala, V. ; Heim, P.J.S. ; Dagenais, Mario ; McClay, C.P.

Author_Institution

Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA

fYear

1996

fDate

2-7 June 1996

Firstpage

222

Abstract

Summary form only given. Here we report on the design and operation of a high-speed monolithically integrated GaAs receiver with MSM photodetector. We also report on a packaging approach to reliably couple light from an optical fiber on to the planar detector. This approach utilizes Si V-groove technology and flip-chip bonding to achieve the required alignment tolerances.

Keywords

III-V semiconductors; flip-chip devices; gallium arsenide; high-speed optical techniques; integrated circuit packaging; integrated optoelectronics; metal-semiconductor-metal structures; optical fibre couplers; optical receivers; photodetectors; GaAs; MSM photodetector; Si; Si V-groove technology; alignment tolerances; flip-chip bonding; high-speed monolithically integrated GaAs receiver; monolithic microwave/optical receiver chip packaging; optical planar detector; Bonding; Decoding; Educational institutions; Gold; Optical fibers; Optical filters; Optical receivers; Optoelectronic devices; Packaging; Photodetectors;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics, 1996. CLEO '96., Summaries of papers presented at the Conference on

Conference_Location

Anaheim, CA, USA

Print_ISBN

1-55752-443-2

Type

conf

Filename

864589