DocumentCode
3548583
Title
Reviewing polycrystalline mercuric iodide X-ray detectors
Author
Schieber, M. ; Zuck, A. ; Gilboa, H. ; Zentai, G.
Author_Institution
Sch. of Appl. Sci. & Technol., Hebrew Univ., Jerusalem
Volume
7
fYear
2004
fDate
16-22 Oct. 2004
Firstpage
4327
Lastpage
4331
Abstract
Polycrystalline films of HgI2, which are used as nuclear radiation detectors, are fabricated by two different methods, either by physical vapor deposition (PVD) or glued with a polymeric binder called also "particle in binder" (PIB). Both types of PVD or PIB detectors are deposited directly on TFT imagers and can be used for X-ray imaging. The present review will concentrate on PVD-poly-HgI2 . However, the main review body will be a summary of the work performed by RTR, HU and Varian. Works by other groups will be mentioned briefly. The PVD process will be explained by reviewing XRD and SEM data. The charge transport properties of the PVD-polycrystalline HgI2 detectors as they improved with R&D efforts will be shown. The response of these PVD detectors to 241Am and 57Co gamma rays and their X-ray imaging properties such as dark currents, sensitivity, and imaging resolution will be reviewed
Keywords
X-ray detection; X-ray diffraction; X-ray imaging; gamma-ray detection; image resolution; mercury compounds; scanning electron microscopy; semiconductor counters; vapour deposition; 241Am; 57Co gamma rays; HgI2; PIB; PVD; PVD-poly-HgI2; PVD-polycrystalline HgI2 detector; R&D efforts; SEM; TFT imagers; X-ray imaging; XRD; charge transport properties; dark currents; imaging resolution; nuclear radiation detectors; particle in binder; physical vapor deposition; polycrystalline films; polycrystalline mercuric iodide X-ray detector; polymeric binder; Atherosclerosis; Chemical vapor deposition; Gamma ray detection; Polymer films; Radiation detectors; Thin film transistors; X-ray detection; X-ray detectors; X-ray imaging; X-ray scattering;
fLanguage
English
Publisher
ieee
Conference_Titel
Nuclear Science Symposium Conference Record, 2004 IEEE
Conference_Location
Rome
ISSN
1082-3654
Print_ISBN
0-7803-8700-7
Electronic_ISBN
1082-3654
Type
conf
DOI
10.1109/NSSMIC.2004.1466845
Filename
1466845
Link To Document