• DocumentCode
    3549697
  • Title

    Novel acoustic techniques for microelectronic failure analysis and characterization

  • Author

    Wong, W.K. ; Street, A.G.

  • Author_Institution
    Centre for IC Failure Anal. & Reliability, Nat. Univ. of Singapore, Singapore
  • fYear
    2005
  • fDate
    27 June-1 July 2005
  • Firstpage
    14
  • Lastpage
    19
  • Abstract
    Acoustic/phonon characterization techniques using active sample probing for localized phonon generation such as scanning electron acoustic microscopy (SEAM), scanning photo or laser acoustic microscopy (SPAM/SLAM) and scanning ion acoustic microscopy (SIAM) are recent developments as extensions of acoustic analysis. In addition to the active electron beam probing mode, passive acoustic detection could also be used in cases where intrinsic phonon generation or phonon-mediated relaxation mechanisms occur during device operation as stated in R. Lifshitz (2002). This technique is currently under active research at the National University of Singapore as a means of dynamically characterizing parameters of microelectromechanical (MEMS) devices such as RF microswitches, resonators, accelerometers and gyroscopes.
  • Keywords
    accelerometers; acoustic microscopy; failure analysis; gyroscopes; micromechanical resonators; microswitches; MEMS accelerometers; MEMS gyroscopes; MEMS resonators; RF microswitches; acoustic analysis; acoustic/phonon characterization; active electron beam probing; active sample probing; laser acoustic microscopy; localized phonon generation; microelectromechanical devices; microelectronic characterization; microelectronic failure analysis; passive acoustic detection; phonon-mediated relaxation mechanisms; scanning electron acoustic microscopy; scanning ion acoustic microscopy; scanning photo acoustic microscopy; Acoustic devices; Character generation; Electron beams; Failure analysis; Laser modes; Microelectronics; Phonons; Scanning electron microscopy; Simultaneous localization and mapping; Unsolicited electronic mail;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the
  • Print_ISBN
    0-7803-9301-5
  • Type

    conf

  • DOI
    10.1109/IPFA.2005.1469123
  • Filename
    1469123