Title :
Etch characterization of packaged IC samples in an RIE with endpoint detection by ICP source for failure analysis applications
Author :
Liao, Joy Y. ; Batteate, Patricia M.
Author_Institution :
NVIDIA Corp., Santa Clara, CA, USA
fDate :
27 June-1 July 2005
Abstract :
In this paper, we propose an accurate endpoint detection method to address etch accuracy and sample overheating, which are major challenges associated with dry etch of multilayer ICs in BGA packages for failure analysis applications. An RIE reactor equipped with an inductively-coupled plasma (ICP) unit was employed. Etch characterization was performed on advanced graphics ICs in BGA packages. We also report on experimentation with procedural development and hardware configuration to combat device overheating.
Keywords :
ball grid arrays; failure analysis; integrated circuit packaging; plasma materials processing; plasma sources; sputter etching; ball grid array package; device overheating; dry etch; endpoint detection; failure analysis; hardware configuration; inductively-coupled plasma; multilayer integrated circuit; reactive ion etching; Application specific integrated circuits; Dry etching; Failure analysis; Graphics; Inductors; Integrated circuit packaging; Nonhomogeneous media; Plasma applications; Plasma devices; Plasma sources;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the
Print_ISBN :
0-7803-9301-5
DOI :
10.1109/IPFA.2005.1469144
